JPH069518Y2 - 樹脂封止形半導体装置 - Google Patents

樹脂封止形半導体装置

Info

Publication number
JPH069518Y2
JPH069518Y2 JP1989130589U JP13058989U JPH069518Y2 JP H069518 Y2 JPH069518 Y2 JP H069518Y2 JP 1989130589 U JP1989130589 U JP 1989130589U JP 13058989 U JP13058989 U JP 13058989U JP H069518 Y2 JPH069518 Y2 JP H069518Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
main surface
resin
solder
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989130589U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0369246U (en]
Inventor
昭雄 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1989130589U priority Critical patent/JPH069518Y2/ja
Publication of JPH0369246U publication Critical patent/JPH0369246U/ja
Application granted granted Critical
Publication of JPH069518Y2 publication Critical patent/JPH069518Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989130589U 1989-11-10 1989-11-10 樹脂封止形半導体装置 Expired - Lifetime JPH069518Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989130589U JPH069518Y2 (ja) 1989-11-10 1989-11-10 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989130589U JPH069518Y2 (ja) 1989-11-10 1989-11-10 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPH0369246U JPH0369246U (en]) 1991-07-09
JPH069518Y2 true JPH069518Y2 (ja) 1994-03-09

Family

ID=31678155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989130589U Expired - Lifetime JPH069518Y2 (ja) 1989-11-10 1989-11-10 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPH069518Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9174779B2 (en) 2007-12-10 2015-11-03 Astrazeneca Ab Vial cap 187

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4572627B2 (ja) * 2004-08-27 2010-11-04 富士電機システムズ株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9174779B2 (en) 2007-12-10 2015-11-03 Astrazeneca Ab Vial cap 187

Also Published As

Publication number Publication date
JPH0369246U (en]) 1991-07-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term